IP Library › Granted Patent US 4,719,250
Granted Patent Utility
US 4,719,250 · App. 06/872,009

Encapsulation of electronic components

Inventors: Nancy C. Eickman, Charles E. McChesney, Gary E. Williams, Hyun-Nam Yoon
Patented Case View Patent ↗
Granted: Jan 12, 1988 Filed: Jun 9, 1986
Inventors
Nancy C. Eickman
Charles E. McChesney
Gary E. Williams
Hyun-Nam Yoon
Assignee (at issue)
Hoechst Celanese Corporation

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Quick Facts
Patent No.
US 4,719,250
App. No.
06/872,009
Filed
1986-06-09
Granted
1988-01-12
Kind
A