Granted Patent
Utility
US 4,722,060 · App. 06/592,144
Integrated-circuit leadframe adapted for a simultaneous bonding operation
Inventors:
Daniel J. Quinn, Robert H. Bond, Wayne A. Mulholland, Steven Swendrowski, Michael A. Olla, Jerry S. Cupples, Barbara R. Mozdzen, Linda S. Wilson, Linn C. Garrison
Patented Case
View Patent ↗
Granted: Jan 26, 1988
Filed: Mar 22, 1984
Inventors
Daniel J. Quinn
Robert H. Bond
Wayne A. Mulholland
Steven Swendrowski
Michael A. Olla
Jerry S. Cupples
Barbara R. Mozdzen
Linda S. Wilson
Linn C. Garrison
Assignee (at issue)
Thomson Components-Moster Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.