Granted Patent
Utility
US 4,734,058 · App. 06/849,633
High density shielded modular connector for stacking printed circuit boards and method of making thereof
Inventor:
Myron Pavlacka
Patented Case
View Patent ↗
Granted: Mar 29, 1988
Filed: May 8, 1986
Inventor
Myron Pavlacka
Assignee (at issue)
Amphenol Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.