Granted Patent
Utility
US 4,743,956 · App. 06/941,691
Offset bending of curvaceously planar radiating leadframe leads in semiconductor chip packaging
Inventors:
Michael A. Olla, Linn C. Garrison, Robert H. Bond, Harold L. Trammell
Patented Case
View Patent ↗
Granted: May 10, 1988
Filed: Dec 15, 1986
Inventors
Michael A. Olla
Linn C. Garrison
Robert H. Bond
Harold L. Trammell
Assignee (at issue)
Thomson Components-Moster Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.