Granted Patent
Utility
US 4,771,016 · App. 07/042,135
Using a rapid thermal process for manufacturing a wafer bonded soi semiconductor
Inventors:
George Bajor, Joseph S. Raby
Patented Case
View Patent ↗
Granted: Sep 13, 1988
Filed: Apr 24, 1987
Inventors
George Bajor
Joseph S. Raby
Assignee (at issue)
HARRIS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.