Granted Patent
Utility
US 4,793,488 · App. 07/070,435
Package for semiconductor wafers
Inventor:
Barry Gregerson
Patented Case
View Patent ↗
Granted: Dec 27, 1988
Filed: Jul 7, 1987
Inventor
Barry Gregerson
Assignee (at issue)
Empak, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.