Granted Patent
Utility
US 4,806,106 · App. 07/037,289
Interconnect lead frame for thermal ink jet printhead and methods of manufacture
Inventors:
Janet E. Mebane, Lawrence Chan, Duong La, Ruben Nevarez
Patented Case
View Patent ↗
Granted: Feb 21, 1989
Filed: Apr 9, 1987
Inventors
Janet E. Mebane
Lawrence Chan
Duong La
Ruben Nevarez
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.