Granted Patent
Utility
US 4,824,693 · App. 07/157,933
Method for depositing a solderable metal layer by an electroless method
Inventors:
Michael Schlipf, Rolf Zondler
Patented Case
View Patent ↗
Granted: Apr 25, 1989
Filed: Feb 19, 1988
Inventors
Michael Schlipf
Rolf Zondler
Assignee (at issue)
Nokia Graetz
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.