Granted Patent
Utility
US 4,842,184 · App. 07/210,736
Method and apparatus for applying solder preforms
Inventor:
Grady A. Miller, Jr.
Patented Case
View Patent ↗
Granted: Jun 27, 1989
Filed: Jun 23, 1988
Inventor
Grady A. Miller, Jr.
Assignee (at issue)
LTV Aerospace and Defense Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.