Granted Patent
Utility
US 4,847,349 · App. 07/044,028
Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines
Inventors:
Masahiro Ohta, Saburo Kawashima, Yoshiho Sonobe, Shoji Tamai, Hideaki Oikawa, Kouji Ohkoshi, Akihiro Yamaguchi
Patented Case
View Patent ↗
Granted: Jul 11, 1989
Filed: Jun 3, 1987
Inventors
Masahiro Ohta
Saburo Kawashima
Yoshiho Sonobe
Shoji Tamai
Hideaki Oikawa
Kouji Ohkoshi
Akihiro Yamaguchi
Assignee (at issue)
Mitsui Toatsu Chemicals, Incorporated
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.