IP Library › Granted Patent US 4,872,607
Granted Patent Utility
US 4,872,607 · App. 07/250,982

Method of bonding semiconductor material to an aluminum foil

Inventors: Millard J. Jensen, Jules D. Levine
Patented Case View Patent ↗
Granted: Oct 10, 1989 Filed: Sep 26, 1988
Inventors
Millard J. Jensen
Jules D. Levine
Assignee (at issue)
Texas Instruments Incorporated

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Quick Facts
Patent No.
US 4,872,607
App. No.
07/250,982
Filed
1988-09-26
Granted
1989-10-10
Kind
A