Granted Patent
Utility
US 4,894,506 · App. 07/246,796
Method and apparatus for reflow soldering of electrical component leads, including floating heater bar
Inventor:
Klaus D. Woerner
Patented Case
View Patent ↗
Granted: Jan 16, 1990
Filed: Sep 20, 1988
Inventor
Klaus D. Woerner
Assignee (at issue)
Automation Tooling Systems Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.