IP Library › Granted Patent US 4,951,123
Granted Patent Utility
US 4,951,123 · App. 07/252,234

Integrated circuit chip assembly utilizing selective backside deposition

Inventors: Soong H. Lee, Chun L. Lau, Daniel C. Buck, Dale E. Dawson
Patented Case View Patent ↗
Granted: Aug 21, 1990 Filed: Sep 30, 1988
Inventors
Soong H. Lee
Chun L. Lau
Daniel C. Buck
Dale E. Dawson
Assignee (at issue)
Westinghouse Electric Company LLC

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Quick Facts
Patent No.
US 4,951,123
App. No.
07/252,234
Filed
1988-09-30
Granted
1990-08-21
Kind
A