Granted Patent
Utility
US 5,010,038 · App. 07/549,611
Method of cooling and powering an integrated circuit chip using a compliant interposing pad
Inventors:
Leslie R. Fox, Paul Wade, William L. Schmidt
Patented Case
View Patent ↗
Granted: Apr 23, 1991
Filed: Jul 9, 1990
Inventors
Leslie R. Fox
Paul Wade
William L. Schmidt
Assignee (at issue)
Digital Equipment Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.