Granted Patent
Utility
US 5,028,987 · App. 07/375,569
High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip
Inventors:
Constantine A. Neugebauer, Robert J. Satriano, James F. Burgess, Homer H. Glascock, II, Victor A. K. Temple, Donald L. Watrous
Patented Case
View Patent ↗
Granted: Jul 2, 1991
Filed: Jul 3, 1989
Inventors
Constantine A. Neugebauer
Robert J. Satriano
James F. Burgess
Homer H. Glascock, II
Victor A. K. Temple
Donald L. Watrous
Assignee (at issue)
General Electric Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.