Granted Patent
Utility
US 5,045,642 · App. 07/509,833
Printed wiring boards with superposed copper foils cores
Inventors:
Hideo Ohta, Kenji Miyamoto, Wilson O. W. San, Alfred M. Martini
Patented Case
View Patent ↗
Granted: Sep 3, 1991
Filed: Apr 17, 1990
Inventors
Hideo Ohta
Kenji Miyamoto
Wilson O. W. San
Alfred M. Martini
Assignees (at issue)
SATOSEN CO., LTD.
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.