Granted Patent
Utility
US 5,045,975 · App. 07/386,290
Three dimensionally interconnected module assembly
Inventors:
Seymour R. Cray, Nicholas J. Krajewski
Patented Case
View Patent ↗
Granted: Sep 3, 1991
Filed: Jul 27, 1989
Inventors
Seymour R. Cray
Nicholas J. Krajewski
Assignee (at issue)
Cray Computer Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.