Granted Patent
Utility
US 5,091,342 · App. 07/315,351
Multilevel resist plated transfer layer process for fine line lithography
Inventors:
Lawrence G. Studebaker, Edward H. Wong
Patented Case
View Patent ↗
Granted: Feb 25, 1992
Filed: Feb 24, 1989
Inventors
Lawrence G. Studebaker
Edward H. Wong
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.