Granted Patent
Utility
US 5,097,387 · App. 07/544,613
Circuit chip package employing low melting point solder for heat transfer
Inventor:
James L. Griffith
Patented Case
View Patent ↗
Granted: Mar 17, 1992
Filed: Jun 27, 1990
Inventor
James L. Griffith
Assignee (at issue)
Digital Equipment Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.