Granted Patent
Utility
US 5,098,860 · App. 07/520,174
Method of fabricating high-density interconnect structures having tantalum/tantalum oxide layers
Inventors:
Kishore K. Chakravorty, Minas H. Tanielian
Patented Case
View Patent ↗
Granted: Mar 24, 1992
Filed: May 7, 1990
Inventors
Kishore K. Chakravorty
Minas H. Tanielian
Assignee (at issue)
The Boeing Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.