Granted Patent
Utility
US 5,099,308 · App. 07/592,689
Semiconductor device having reverse conductivity-type diffusion layer and semiconductor wiring layer connected by metallic connection wiring layer
Inventor:
Motoaki Murayama
Patented Case
View Patent ↗
Granted: Mar 24, 1992
Filed: Oct 3, 1990
Inventor
Motoaki Murayama
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.