Granted Patent
Utility
US 5,157,001 · App. 07/583,185
Method of dicing semiconductor wafer along protective film formed on scribe lines
Inventor:
Masahiro Sakuma
Patented Case
View Patent ↗
Granted: Oct 20, 1992
Filed: Sep 14, 1990
Inventor
Masahiro Sakuma
Assignee (at issue)
SUMITOMO ELECTRIC INDUSTRIES, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.