Granted Patent
Utility
US 5,183,769 · App. 07/696,405
Vertical current flow semiconductor device utilizing wafer bonding
Inventors:
Robert E. Rutter, Frank S. d'Aragona
Patented Case
View Patent ↗
Granted: Feb 2, 1993
Filed: May 6, 1991
Inventors
Robert E. Rutter
Frank S. d'Aragona
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.