Granted Patent
Utility
US 5,187,123 · App. 07/815,621
Method for bonding a semiconductor device to a lead frame die pad using plural adhesive spots
Inventors:
Hiroyoshi Yoshida, Yuki Koishi
Patented Case
View Patent ↗
Granted: Feb 16, 1993
Filed: Dec 30, 1991
Inventors
Hiroyoshi Yoshida
Yuki Koishi
Assignee (at issue)
SUMITOMO ELECTRIC INDUSTRIES, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.