Granted Patent
Utility
US 5,198,695 · App. 07/624,783
Semiconductor wafer with circuits bonded to a substrate
Inventors:
Maurice H. Hanes, Rowland C. Clarke, Michael C. Driver
Patented Case
View Patent ↗
Granted: Mar 30, 1993
Filed: Dec 10, 1990
Inventors
Maurice H. Hanes
Rowland C. Clarke
Michael C. Driver
Assignee (at issue)
Westinghouse Electric Company LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.