Granted Patent
Utility
US 5,208,658 · App. 07/809,148
Semiconductor integrated circuit provided with contact for inter-layer connection and method of inter-layer connection therefor
Inventor:
Masaomi Murata
Patented Case
View Patent ↗
Granted: May 4, 1993
Filed: Dec 18, 1991
Inventor
Masaomi Murata
Assignee (at issue)
Kawasaki Steel Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.