Granted Patent
Utility
US 5,216,806 · App. 07/939,319
Method of forming a chip package and package interconnects
Inventor:
Ken Lam
Patented Case
View Patent ↗
Granted: Jun 8, 1993
Filed: Sep 1, 1992
Inventor
Ken Lam
Assignee (at issue)
Atmel Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.