Granted Patent
Utility
US 5,258,891 · App. 07/797,920
Multichip module with multilayer wiring substrate
Inventor:
Norimitsu Sako
Patented Case
View Patent ↗
Granted: Nov 2, 1993
Filed: Nov 26, 1991
Inventor
Norimitsu Sako
Assignee (at issue)
Kawasaki Steel Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.