Granted Patent
Utility
US 5,291,066 · App. 07/791,690
Moisture-proof electrical circuit high density interconnect module and method for making same
Inventors:
Constantine A. Neugebauer, Herbert S. Cole, Eugene L. Bartels, Raymond Albert Fillion
Patented Case
View Patent ↗
Granted: Mar 1, 1994
Filed: Nov 14, 1991
Inventors
Constantine A. Neugebauer
Herbert S. Cole
Eugene L. Bartels
Raymond Albert Fillion
Assignee (at issue)
General Electric Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.