Granted Patent
Utility
US 5,296,742 · App. 07/795,731
Multilayered integrated circuit chip wiring arrangement
Inventor:
Isami Sakai
Patented Case
View Patent ↗
Granted: Mar 22, 1994
Filed: Nov 21, 1991
Inventor
Isami Sakai
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.