Granted Patent
Utility
US 5,362,358 · App. 08/061,440
Dry etching apparatus and method of forming a via hole in an interlayer insulator using same
Inventors:
Yasushi Yamagata, Fumihide Sato
Patented Case
View Patent ↗
Granted: Nov 8, 1994
Filed: May 14, 1993
Inventors
Yasushi Yamagata
Fumihide Sato
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.