Granted Patent
Utility
US 5,376,588 · App. 08/198,723
Method for making high pin count package for semiconductor device
Inventor:
Rajendra D. Pendse
Patented Case
View Patent ↗
Granted: Dec 27, 1994
Filed: Feb 18, 1994
Inventor
Rajendra D. Pendse
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.