Granted Patent
Utility
US 5,389,160 · App. 08/069,640
Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
Inventors:
Cynthia M. Melton, William M. Beckenbaugh, Dennis Brian Miller
Patented Case
View Patent ↗
Granted: Feb 14, 1995
Filed: Jun 1, 1993
Inventors
Cynthia M. Melton
William M. Beckenbaugh
Dennis Brian Miller
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.