Granted Patent
Utility
US 5,389,743 · App. 07/993,544
Rivet design for enhanced copper thick-film I/O pad adhesion
Inventors:
Charles E. Simila, Mradul Mehrotra
Patented Case
View Patent ↗
Granted: Feb 14, 1995
Filed: Dec 21, 1992
Inventors
Charles E. Simila
Mradul Mehrotra
Assignee (at issue)
Hughes Aircraft Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.