IP Library › Granted Patent US 5,391,285
Granted Patent Utility
US 5,391,285 · App. 08/202,210

Adjustable plating cell for uniform bump plating of semiconductor wafers

Inventors: William H. Lytle, Tien-Yu Lee, Bennett L. Hileman
Patented Case View Patent ↗
Granted: Feb 21, 1995 Filed: Feb 25, 1994
Inventors
William H. Lytle
Tien-Yu Lee
Bennett L. Hileman
Assignee (at issue)
Motorola, Inc.

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Quick Facts
Patent No.
US 5,391,285
App. No.
08/202,210
Filed
1994-02-25
Granted
1995-02-21
Kind
A