IP Library Granted Patent US 5,405,577
Granted Patent Utility
US 5,405,577 · App. 08/225,826

Lead-free and bismuth-free tin alloy solder composition

Inventors: Karl Seelig, Donald G. Lockard
Patented Case View Patent ↗
Granted: Apr 11, 1995 Filed: Apr 11, 1994
Inventors
Karl Seelig
Donald G. Lockard

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Quick Facts
Patent No.
US 5,405,577
App. No.
08/225,826
Filed
1994-04-11
Granted
1995-04-11
Kind
A