Granted Patent
Utility
US 5,406,124 · App. 08/158,417
Insulating adhesive tape, and lead frame and semiconductor device employing the tape
Inventors:
Moritsugu Morita, Kimiteru Tagawa, Kenji Abe, Naoshi Mineta, Takayuki Kubo, Shigeo Kiba, Etsuo Ohkawado, Kenji Tanabe
Patented Case
View Patent ↗
Granted: Apr 11, 1995
Filed: Nov 29, 1993
Inventors
Moritsugu Morita
Kimiteru Tagawa
Kenji Abe
Naoshi Mineta
Takayuki Kubo
Shigeo Kiba
Etsuo Ohkawado
Kenji Tanabe
Assignee (at issue)
Mitsui Toatsu Chemicals, Incorporated
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.