Granted Patent
Utility
US 5,414,214 · App. 08/265,985
Resistance heated, sealed microfabricated device package method and apparatus
Inventors:
Frederick Y. Cho, Michael J. Anderson, Howard D. Knuth
Patented Case
View Patent ↗
Granted: May 9, 1995
Filed: Jun 27, 1994
Inventors
Frederick Y. Cho
Michael J. Anderson
Howard D. Knuth
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.