Granted Patent
Utility
US 5,420,506 · App. 08/079,623
Apparatus and method for testing packaged integrated circuits
Inventor:
Chao-Hui Lin
Patented Case
View Patent ↗
Granted: May 30, 1995
Filed: Jun 18, 1993
Inventor
Chao-Hui Lin
Assignee (at issue)
Industrial Technology Research Institute
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.