Granted Patent
Utility
US 5,427,878 · App. 08/243,558
Semiconductor wafer processing with across-wafer critical dimension monitoring using optical endpoint detection
Inventor:
Daniel A. Corliss
Patented Case
View Patent ↗
Granted: Jun 27, 1995
Filed: May 16, 1994
Inventor
Daniel A. Corliss
Assignee (at issue)
Digital Equipment Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.