IP Library › Granted Patent US 5,429,510
Granted Patent Utility
US 5,429,510 · App. 08/161,282

High-density interconnect technique

Inventors: William D. Barraclough, Mikhail A. Alperin, Jeffrey A. Brehm, John Hoang, Patrick M. Shepherd, James F. Tomic
Patented Case View Patent ↗
Granted: Jul 4, 1995 Filed: Dec 1, 1993
Inventors
William D. Barraclough
Mikhail A. Alperin
Jeffrey A. Brehm
John Hoang
Patrick M. Shepherd
James F. Tomic
Assignee (at issue)
AEHR TEST SYSTEMS

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Quick Facts
Patent No.
US 5,429,510
App. No.
08/161,282
Filed
1993-12-01
Granted
1995-07-04
Kind
A