Granted Patent
Utility
US 5,441,595 · App. 08/238,370
Dry etching apparatus and method of forming a via hole in an interlayer insulator using same
Inventors:
Yasushi Yamagata, Fumihide Sato
Patented Case
View Patent ↗
Granted: Aug 15, 1995
Filed: May 5, 1994
Inventors
Yasushi Yamagata
Fumihide Sato
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.