Granted Patent
Utility
US 5,444,023 · App. 08/179,718
Method of fabricating a semiconductor device having a multilayer wiring structure and using a fluorine compound-containing gas
Inventor:
Tetsuya Homma
Patented Case
View Patent ↗
Granted: Aug 22, 1995
Filed: Jan 11, 1994
Inventor
Tetsuya Homma
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.