Granted Patent
Utility
US 5,449,883 · App. 08/041,316
Continuous heat treatment system of semiconductor wafers for eliminating thermal donor
Inventor:
Shoji Tsuruta
Patented Case
View Patent ↗
Granted: Sep 12, 1995
Filed: Mar 31, 1993
Inventor
Shoji Tsuruta
Assignees (at issue)
MITSUBISHI MATERIALS CORPORATION
Mitsubishi Materials Silicon Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.