Granted Patent
Utility
US 5,460,318 · App. 08/252,478
Diebonding geometry for packaging optoelectronics
Inventors:
Robert A. Boudreau, Richard H. Sargent
Patented Case
View Patent ↗
Granted: Oct 24, 1995
Filed: Jun 1, 1994
Inventors
Robert A. Boudreau
Richard H. Sargent
Assignee (at issue)
GTE Laboratories Incorporated
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.