IP Library › Granted Patent US 5,461,333
Granted Patent Utility
US 5,461,333 · App. 08/200,986

Multi-chip modules having chip-to-chip interconnections with reduced signal voltage level and swing

Inventors: Joseph Henry Condon, Robert C. Frye, Thaddeus John Gabara, King Lien Tai, Scott C. Knauer, Carroll H. Knauer, executor
Patented Case View Patent ↗
Granted: Oct 24, 1995 Filed: Feb 24, 1994
Inventors
Joseph Henry Condon
Robert C. Frye
Thaddeus John Gabara
King Lien Tai
Scott C. Knauer
Carroll H. Knauer, executor
Assignee (at issue)
AT & T IPM Corp.

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Quick Facts
Patent No.
US 5,461,333
App. No.
08/200,986
Filed
1994-02-24
Granted
1995-10-24
Kind
A