Granted Patent
Utility
US 5,486,492 · App. 08/142,971
Method of forming multilayered wiring structure in semiconductor device
Inventors:
Hiroshi Yamamoto, Nobuyuki Takeyasu, Tomohiro Ohta
Patented Case
View Patent ↗
Granted: Jan 23, 1996
Filed: Oct 29, 1993
Inventors
Hiroshi Yamamoto
Nobuyuki Takeyasu
Tomohiro Ohta
Assignee (at issue)
Kawasaki Steel Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.