Granted Patent
Utility
US 5,499,312 · App. 08/299,176
Passive alignment and packaging of optoelectronic components to optical waveguides using flip-chip bonding technology
Inventors:
Kenneth H. Hahn, Ronald Kaneshiro
Patented Case
View Patent ↗
Granted: Mar 12, 1996
Filed: Aug 31, 1994
Inventors
Kenneth H. Hahn
Ronald Kaneshiro
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.