Granted Patent
Utility
US 5,506,383 · App. 08/386,893
Wafer scale multi-chip module
Inventor:
Yaw-Hwang Chen
Patented Case
View Patent ↗
Granted: Apr 9, 1996
Filed: Feb 10, 1995
Inventor
Yaw-Hwang Chen
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.