Granted Patent
Utility
US 5,522,520 · App. 08/388,455
Method for forming an interconnection in a semiconductor device
Inventor:
Hideaki Kawamoto
Patented Case
View Patent ↗
Granted: Jun 4, 1996
Filed: Feb 14, 1995
Inventor
Hideaki Kawamoto
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.